Quantity per case: 4. Dielectric structure: Diode bridge. Semiconductor material: silicon. Forward current (AV): 8A. IFSM: 200A. MRI (max): 500uA. MRI (min): 5uA. Equivalents: KBU8M, KBU807. Number of terminals: 4. Pitch: 5.08x5.08mm. Dimensions: 21.5x18.3x3.4mm. RoHS: yes. Assembly/installation: PCB through-hole mounting. Operating temperature: -50...+150°C. Threshold voltage Vf (max): 1V. Forward voltage Vf (min): 1V. VRRM: 1000V. Spec info: IFSM--200Ap (t=8.3ms), IFSM--180Ap (t=10ms)