Soldering paste and flux

Diameter: 1mm. Eutectic: no. Solder flux capacity: 2.5%/3/SW26. Solder temperature: +250...+385°C. Note: for professional users only. Note: equipment subject to regulation. Chemical composition: Sn60/Pb40%. Solidification point (°C): +183°C. Melting point (°C): +190°C. Weight: 500g

Diameter: 1.5mm. Eutectic: no. Solder flux capacity: 2.5%/3/SW26. Solder temperature: +250...+385°C. Note: for professional users only. Note: equipment subject to regulation. Chemical composition: Sn60/Pb40%. Solidification point (°C): +183°C. Melting point (°C): +190°C. Weight: 500g

Diameter: 2.5mm. Eutectic: no. Solder flux capacity: 2.5%/3/SW26. Solder temperature: +250...+385°C. Note: for professional users only. Note: equipment subject to regulation. Chemical composition: Sn60/Pb40%. Solidification point (°C): +183°C. Melting point (°C): +190°C. Weight: 500g

Function: Flux dispenser and pen for application. Spec info: Flux pen 10ml and dropper 20ml

Compatibility: syringe. Function: Needle for flux or paste syringe. Note: for 5, 10, 30ml syringe. Spec info: needle alone

Compatibility: syringe. Function: Needle for flux or paste syringe. Note: for 5, 10, 30ml syringe. Spec info: needle alone

Compatibility: syringe. Function: Needle for flux or paste syringe. Note: for 5, 10, 30ml syringe. Spec info: needle alone

Compatibility: syringe. Function: Extruder for flux or paste syringe. Note: for 10ml syringe. Spec info: 8.2k Ohms

Function: Extruder for flux or paste syringe. Note: for 30ml syringe. Spec info: 8.2k Ohms

Note: syringe. Note: solder paste dispenser. Note: pump

Eutectic: yes. Solder flux capacity: 2%. Solder temperature: +250...+385°C. Function: SMD solder paste. Note: for professional users only. Note: equipment subject to regulation. Chemical composition: Sn62%, Pb36%, Ag2%. Solidification point (°C): +183°C. Melting point (°C): +183°C. Spec info: without cleaning (No Clean)

Eutectic: yes. Function: SMD solder paste. Note: for professional users only. Note: equipment subject to regulation. Chemical composition: Sn62%, Pb36%, Ag2%. Spec info: without cleaning (No Clean)

Diameter: 28...45um. Eutectic: yes. Solder temperature: +280...+410°C. Chemical composition: SN96.5%, AG3%, Cu0.5%. Solidification point (°C): +217°C. Melting point (°C): +217°C. RoHS: yes. Note: SMD soldering paste, lead-free

Diameter: 28...45um. Eutectic: yes. Solder temperature: +280...+410°C. Chemical composition: SN96.5%, AG3%, Cu0.5%. Solidification point (°C): +217°C. Melting point (°C): +217°C. RoHS: yes. Function: SMD soldering paste, lead-free. Spec info: No cleaning

Diameter: 28...45um. Eutectic: yes. Solder temperature: +280...+410°C. Chemical composition: SN96.5%, AG3%, Cu0.5%. Solidification point (°C): +217°C. Melting point (°C): +217°C. RoHS: yes. Function: SMD soldering paste, lead-free. Spec info: No cleaning

Eutectic: yes. Solder temperature: Above +140°C. Function: Lead-free SMD solder paste. Chemical composition: SN 42%, AG 1%, BI 57%. Melting point (°C): 140°C. RoHS: yes. Various: melting and soldering temperature reducer. Spec info: No cleaning

Diameter: 0.8mm. Eutectic: yes. Solder temperature: Around +118°C. Function: Lead-free SMD solder paste. Chemical composition: Sn--48%, In--52%. Configuration: about 3m in the spool. Melting point (°C): 118°C. RoHS: yes. Various: melting and soldering temperature reducer. Spec info: with special no-clean flow provided

Diameter: 1.5mm. Eutectic: no. Solder flux capacity: 2.5%/3/SW26. Solder temperature: +250...+385°C. Note: for professional users only. Note: equipment subject to regulation. Chemical composition: Sn60/Pb40%. Solidification point (°C): +183°C. Melting point (°C): +190°C. Weight: 1kg

Diameter: 0.56mm. Eutectic: no. Solder flux capacity: 2.5%/3/SW26. Solder temperature: +250...+385°C. Note: for professional users only. Note: equipment subject to regulation. Chemical composition: Sn60/Pb40%. Solidification point (°C): +183°C. Melting point (°C): +190°C. Weight: 1kg

Diameter: 0.7mm. Eutectic: no. Solder flux capacity: 2.5%/3/SW26. Solder temperature: +250...+385°C. Note: for professional users only. Note: equipment subject to regulation. Chemical composition: Sn60/Pb40%. Solidification point (°C): +183°C. Melting point (°C): +190°C. Weight: 1kg

Diameter: 1.5mm. Eutectic: no. Solder flux capacity: 2.5%/3/SW26. Solder temperature: +250...+385°C. Note: for professional users only. Note: equipment subject to regulation. Chemical composition: Sn60/Pb40%. Solidification point (°C): +183°C. Melting point (°C): +190°C. Weight: 1kg

Diameter: 0.25mm. Eutectic: no. Solder flux capacity: 2.5%/3/SW26. Solder temperature: +250...+385°C. Note: for professional users only. Note: equipment subject to regulation. Chemical composition: Sn60/Pb40%. Solidification point (°C): +183°C. Melting point (°C): +190°C. Weight: 100g

Diameter: 0.56mm. Eutectic: no. Solder flux capacity: 2.5%/3/SW26. Solder temperature: +250...+385°C. Note: for professional users only. Note: equipment subject to regulation. Chemical composition: Sn60/Pb40%. Solidification point (°C): +183°C. Melting point (°C): +190°C. Weight: 100g

Diameter: 1.5mm. Eutectic: no. Solder flux capacity: 2.5% / SW26. Solder temperature: +250...+385°C. Note: for professional users only. Note: equipment subject to regulation. Chemical composition: Sn60/Pb40%. Solidification point (°C): +183°C. Melting point (°C): +190°C. Weight: 100g

Diameter: 0.5mm. Eutectic: no. Solder flux capacity: 2.5%/3/SW26. Solder temperature: +250...+385°C. Note: for professional users only. Note: equipment subject to regulation. Chemical composition: Sn60/Pb40%. Solidification point (°C): +183°C. Melting point (°C): +190°C. Weight: 250g