RAM memory circuits

RoHS: yes. Component family: Memory integrated circuit. Housing: PCB soldering (SMD). Housing: SO8. Configuration: surface-mounted component (SMD). Number of terminals: 8. Memory circuit family: 23LC. Memory size [byte]: 1Mbit. Memory configuration: 128K x 8-bit. Interface type: SPI. Operating temperature range min (°C): -40°C. Operating temperature range max (°C): +85°C. Max clock signal (MHz): 20 MHz. Memory type: SRAM memory, serial bus access. Minimum supply voltage (V): +2.5V. Maximum supply voltage (V): +5.5V

RoHS: no. Component family: Memory integrated circuit. Housing: PCB soldering. Housing: DIP24. Configuration: PCB through-hole mounting. Number of terminals: 24. Memory size [byte]: 2 KByte. Memory configuration: 2K x 8-bit. Interface type: Parallel. Operating temperature range min (°C): 0°C. Operating temperature range max (°C): +70°C. Max clock signal (MHz): 100 ns. Memory type: SRAM memory, parallel bus access

RoHS: no. Component family: Memory integrated circuit. Housing: PCB soldering. Housing: DIP32. Configuration: PCB through-hole mounting. Number of terminals: 32. Memory circuit family: U62. Memory size [byte]: 128 KByte. Memory configuration: 128K x 8-bit. Interface type: Parallel. Operating temperature range min (°C): 0°C. Operating temperature range max (°C): +70°C. Max clock signal (MHz): 70 ns. Memory type: SRAM memory, parallel bus access. Minimum supply voltage (V): +4.5V. Maximum supply voltage (V): +5.5V

RoHS: no. Component family: Memory integrated circuit. Housing: PCB soldering (SMD). Housing: SO28W. Configuration: surface-mounted component (SMD). Number of terminals: 28. Memory circuit family: U62. Memory size [byte]: 8 KByte. Memory configuration: 8K x 8-bit. Interface type: Parallel. Operating temperature range min (°C): 0°C. Operating temperature range max (°C): +70°C. Max clock signal (MHz): 70 ns. Memory type: SRAM memory, parallel bus access. Minimum supply voltage (V): +4.5V. Maximum supply voltage (V): +5.5V

RoHS: no. Component family: Memory integrated circuit. Housing: PCB soldering (SMD). Housing: SO28W. Configuration: surface-mounted component (SMD). Number of terminals: 28. Memory circuit family: U62H. Memory size [byte]: 32 KByte. Memory configuration: 32K x 8-bit. Interface type: Parallel. Operating temperature range min (°C): -40°C. Operating temperature range max (°C): +85°C. Max clock signal (MHz): 55 ns. Memory type: SRAM memory, parallel bus access. Minimum supply voltage (V): +4.5V. Maximum supply voltage (V): +5.5V

RoHS: yes. Component family: Memory integrated circuit. Housing: PCB soldering. Housing: DIP28. Configuration: PCB through-hole mounting. Number of terminals: 28. Memory circuit family: A62. Memory size [byte]: 8 KByte. Memory configuration: 8K x 8-bit. Interface type: Parallel. Operating temperature range min (°C): 0°C. Operating temperature range max (°C): +70°C. Max clock signal (MHz): 70 ns. Memory type: SRAM memory, parallel bus access. Minimum supply voltage (V): +4.5V. Maximum supply voltage (V): +5.5V

RoHS: yes. Component family: Memory integrated circuit. Housing: PCB soldering. Housing: DIP32. Configuration: PCB through-hole mounting. Number of terminals: 32. Memory circuit family: AS6C. Memory size [byte]: 128 KByte. Memory configuration: 128K x 8-bit. Interface type: Parallel. Operating temperature range min (°C): 0°C. Operating temperature range max (°C): +70°C. Max clock signal (MHz): 55 ns. Memory type: SRAM memory, parallel bus access. Minimum supply voltage (V): +2.7V. Maximum supply voltage (V): +5.5V

RoHS: yes. Component family: Memory integrated circuit. Housing: PCB soldering (SMD). Housing: SO32W. Configuration: surface-mounted component (SMD). Number of terminals: 32. Memory circuit family: AS6C. Memory size [byte]: 128 KByte. Memory configuration: 128K x 8-bit. Interface type: Parallel. Operating temperature range min (°C): -40°C. Operating temperature range max (°C): +85°C. Max clock signal (MHz): 55 ns. Memory type: SRAM memory, parallel bus access. Minimum supply voltage (V): +2.7V. Maximum supply voltage (V): +5.5V

RoHS: yes. Component family: Memory integrated circuit. Housing: PCB soldering (SMD). Housing: SO32W. Configuration: surface-mounted component (SMD). Number of terminals: 32. Memory circuit family: AS6C. Memory size [byte]: 128 KByte. Memory configuration: 128K x 8-bit. Interface type: Parallel. Operating temperature range min (°C): -40°C. Operating temperature range max (°C): +85°C. Max clock signal (MHz): 55 ns. Memory type: SRAM memory, parallel bus access. Minimum supply voltage (V): +2.7V. Maximum supply voltage (V): +5.5V

RoHS: yes. Component family: Memory integrated circuit. Housing: PCB soldering (SMD). Housing: SO32W. Configuration: surface-mounted component (SMD). Number of terminals: 32. Memory circuit family: AS6C. Memory size [byte]: 512 KByte. Memory configuration: 512K x 8-bit. Interface type: Parallel. Operating temperature range min (°C): -40°C. Operating temperature range max (°C): +85°C. Max clock signal (MHz): 55 ns. Memory type: SRAM memory, parallel bus access. Minimum supply voltage (V): +2.7V. Maximum supply voltage (V): +5.5V

RoHS: yes. Component family: Memory integrated circuit. Housing: PCB soldering (SMD). Housing: SO28W. Configuration: surface-mounted component (SMD). Number of terminals: 28. Memory circuit family: AS6C. Memory size [byte]: 32 KByte. Memory configuration: 32K x 8-bit. Interface type: Parallel. Operating temperature range min (°C): -40°C. Operating temperature range max (°C): +85°C. Max clock signal (MHz): 55 ns. Memory type: SRAM memory, parallel bus access. Minimum supply voltage (V): +2.7V. Maximum supply voltage (V): +5.5V

RoHS: yes. Component family: Memory integrated circuit. Housing: PCB soldering. Housing: DIP28. Configuration: PCB through-hole mounting. Number of terminals: 28. Memory circuit family: AS6C. Memory size [byte]: 32 KByte. Memory configuration: 32K x 8-bit. Interface type: Parallel. Operating temperature range min (°C): -40°C. Operating temperature range max (°C): +85°C. Max clock signal (MHz): 70 ns. Memory type: SRAM memory, parallel bus access. Minimum supply voltage (V): +2.7V. Maximum supply voltage (V): +5.5V

RoHS: yes. Component family: Memory integrated circuit. Housing: PCB soldering (SMD). Housing: TSOP28. Configuration: surface-mounted component (SMD). Number of terminals: 28. Memory circuit family: BS62LV. Memory size [byte]: 32 KByte. Memory configuration: 32K x 8-bit. Interface type: Parallel. Operating temperature range min (°C): -40°C. Operating temperature range max (°C): +85°C. Max clock signal (MHz): 70 ns. Memory type: SRAM memory, parallel bus access. Minimum supply voltage (V): +2.4V. Maximum supply voltage (V): +5.5V

RoHS: yes. Component family: Memory integrated circuit. Housing: PCB soldering. Housing: DIP32. Configuration: PCB through-hole mounting. Number of terminals: 32. Memory circuit family: BS62LV. Memory size [byte]: 512 KByte. Memory configuration: 512K x 8-bit. Interface type: Parallel. Operating temperature range min (°C): -40°C. Operating temperature range max (°C): +85°C. Max clock signal (MHz): 55 ns. Memory type: SRAM memory, parallel bus access. Minimum supply voltage (V): +2.4V. Maximum supply voltage (V): +5.5V

RoHS: yes. Component family: Memory integrated circuit. Housing: PCB soldering. Housing: DIP24. Configuration: PCB through-hole mounting. Number of terminals: 24. Memory circuit family: DS12. Memory size [byte]: 2 KByte. Memory configuration: 2K x 8-bit. Interface type: Parallel. Operating temperature range min (°C): 0°C. Operating temperature range max (°C): +70°C. Max clock signal (MHz): 100 ns. Memory type: battery-backed SRAM, parallel access. Minimum supply voltage (V): +4.5V. Maximum supply voltage (V): +5.5V

RoHS: yes. Component family: Memory integrated circuit. Housing: PCB soldering. Housing: DIP28. Configuration: PCB through-hole mounting. Number of terminals: 28. Memory circuit family: DS12. Memory size [byte]: 8 KByte. Memory configuration: 8K x 8-bit. Interface type: Parallel. Operating temperature range min (°C): 0°C. Operating temperature range max (°C): +70°C. Max clock signal (MHz): 150 ns. Memory type: battery-backed SRAM, parallel access. Minimum supply voltage (V): +4.5V. Maximum supply voltage (V): +5.5V

RoHS: yes. Component family: Memory integrated circuit. Housing: PCB soldering (SMD). Housing: TSOP2-44. Configuration: surface-mounted component (SMD). Number of terminals: 44. Memory circuit family: IS61LV. Memory size [byte]: 256 KByte. Memory configuration: 128K x 16-bit. Interface type: Parallel. Operating temperature range min (°C): -40°C. Operating temperature range max (°C): +85°C. Max clock signal (MHz): 10 ns. Memory type: SRAM memory, parallel bus access. Minimum supply voltage (V): +3V. Maximum supply voltage (V): +3.6V

RoHS: no. Component family: Memory integrated circuit. Housing: PCB soldering (SMD). Housing: TSOP2-32. Configuration: surface-mounted component (SMD). Number of terminals: 32. Memory circuit family: K6R. Memory size [byte]: 128 KByte. Memory configuration: 128K x 8-bit. Interface type: Parallel. Operating temperature range min (°C): 0°C. Operating temperature range max (°C): +70°C. Max clock signal (MHz): 10 ns. Memory type: SRAM memory, parallel bus access. Minimum supply voltage (V): +4.5V. Maximum supply voltage (V): +5.5V

RoHS: no. Component family: Memory integrated circuit. Housing: PCB soldering (SMD). Housing: TSOP2-F32. Configuration: surface-mounted component (SMD). Number of terminals: 32. Memory circuit family: K6T. Memory size [byte]: 512 KByte. Memory configuration: 512K x 8-bit. Interface type: Parallel. Operating temperature range min (°C): -40°C. Operating temperature range max (°C): +85°C. Max clock signal (MHz): 55 ns. Memory type: SRAM memory, parallel bus access. Minimum supply voltage (V): +4.5V. Maximum supply voltage (V): +5.5V

RoHS: yes. Component family: Memory integrated circuit. Housing: PCB soldering. Housing: DIP24. Configuration: PCB through-hole mounting. Number of terminals: 24. Memory circuit family: M48T. Memory size [byte]: 2 KByte. Memory configuration: 2K x 8-bit. Interface type: Parallel. Operating temperature range min (°C): 0°C. Operating temperature range max (°C): +70°C. Max clock signal (MHz): 70 ns. Memory type: battery-backed SRAM, parallel access. Minimum supply voltage (V): +4.75V. Maximum supply voltage (V): +5.5V

RoHS: yes. Component family: Memory integrated circuit. Housing: PCB soldering. Housing: DIP28. Configuration: PCB through-hole mounting. Number of terminals: 28. Memory circuit family: M48Z. Memory size [byte]: 8 KByte. Memory configuration: 8K x 8-bit. Interface type: Parallel. Operating temperature range min (°C): 0°C. Operating temperature range max (°C): +70°C. Max clock signal (MHz): 100 ns. Memory type: battery-backed SRAM, parallel access. Minimum supply voltage (V): +4.75V. Maximum supply voltage (V): +5.5V. Housing (JEDEC standard): PCB through-hole mounting

RoHS: yes. Component family: interface integrated circuit. Housing: PCB soldering (SMD). Housing: SO16. Configuration: surface-mounted component (SMD). Number of terminals: 16. Number of control circuits: 0. Number of receiving circuits: 4. Type of communication: Duplex. Deactivatable: yes. Communication speed [bit]: 10Mbit. Operating temperature range min (°C): 0°C. Operating temperature range max (°C): +70°C. Type of circuits: serial interface, differential receiver. Minimum supply voltage (V): +4.5V. Maximum supply voltage (V): +5.5V. Number of receiver circuits on the line, max: 128

RoHS: yes. Component family: Memory integrated circuit. Housing: PCB soldering (SMD). Housing: SO32W. Configuration: surface-mounted component (SMD). Number of terminals: 32. Memory circuit family: R1LP. Memory size [byte]: 512 KByte. Memory configuration: 512K x 8-bit. Interface type: Parallel. Operating temperature range min (°C): -40°C. Operating temperature range max (°C): +85°C. Max clock signal (MHz): 55 ns. Memory type: SRAM memory, parallel bus access. Minimum supply voltage (V): +4.5V. Maximum supply voltage (V): +5.5V

RoHS: yes. Component family: Memory integrated circuit. Housing: PCB soldering (SMD). Housing: SO32W. Configuration: surface-mounted component (SMD). Number of terminals: 32. Memory circuit family: R1LV. Memory size [byte]: 512 KByte. Memory configuration: 512K x 8-bit. Interface type: Parallel. Operating temperature range min (°C): -40°C. Operating temperature range max (°C): +85°C. Max clock signal (MHz): 55 ns. Memory type: SRAM memory, parallel bus access. Minimum supply voltage (V): +2.7V. Maximum supply voltage (V): +3.6V

RoHS: yes. Component family: Memory integrated circuit. Housing: PCB soldering (SMD). Housing: SO32W. Configuration: surface-mounted component (SMD). Number of terminals: 32. Memory circuit family: R1LV. Memory size [byte]: 512 KByte. Memory configuration: 512K x 8-bit. Interface type: Parallel. Operating temperature range min (°C): -40°C. Operating temperature range max (°C): +85°C. Max clock signal (MHz): 55 ns. Memory type: SRAM memory, parallel bus access. Minimum supply voltage (V): +2.7V. Maximum supply voltage (V): +3.6V