Zener diodes

RoHS: yes. Component family: zener diode, SMD mounting, max 250mW. Housing: PCB soldering (SMD). Housing: SOT-23. Housing (JEDEC standard): TO-236AB. Configuration: surface-mounted component (SMD). Number of terminals: 3. Zener breakdown voltage Uz [V], nom.: 5.1V. Leakage current on closing Ir [A] @ Ur [V]: 2uA @ 2V. Zener Impedance Zzt[Ohm] @ Iz[A]: 400 Ohms @ 1mA. Maximum dissipation Ptot [W]: 0.25W. Operating temperature range min (°C): -65°C. Operating temperature range max (°C): +150°C

Semiconductor material: silicon. Dimensions: 2.9x1.5mm. Pd (Power Dissipation, Max): 0.35W. RoHS: yes. Assembly/installation: surface-mounted component (SMD). Housing: SOT-23 ( TO-236 ). Tolerance: 5%. Zener voltage: 62V. Number of terminals: 3

Semiconductor material: silicon. Marking on the case: Z9. Pd (Power Dissipation, Max): 0.35W. RoHS: yes. Pitch: 2.9x1.5mm. Assembly/installation: surface-mounted component (SMD). Housing: SOT-23 ( TO-236 ). Zener voltage: 10V. Note: SI-Z SMD

Semiconductor material: silicon. Pd (Power Dissipation, Max): 0.35W. RoHS: yes. Pitch: 2.9x1.5mm. Assembly/installation: surface-mounted component (SMD). Housing: SOT-23 ( TO-236 ). Housing (according to data sheet): SOT-23. Tolerance: 5%. Operating temperature: -55...+150°C. Zener voltage: 11V. Number of terminals: 3. Operating temperature range min (°C): -65°C. Operating temperature range max (°C): +150°C

RoHS: yes. Component family: zener diode, SMD mounting, max 250mW. Housing: PCB soldering (SMD). Housing: SOT-23. Housing (JEDEC standard): TO-236AB. Configuration: surface-mounted component (SMD). Number of terminals: 3. Zener breakdown voltage Uz [V], nom.: 11V. Leakage current on closing Ir [A] @ Ur [V]: 0.1uA @ 8V. Zener Impedance Zzt[Ohm] @ Iz[A]: 20 Ohms @ 5mA. Maximum dissipation Ptot [W]: 0.25W. Operating temperature range min (°C): -65°C. Operating temperature range max (°C): +150°C

RoHS: yes. Component family: zener diode, SMD mounting, max 250mW. Housing: PCB soldering (SMD). Housing: SOT-23. Housing (JEDEC standard): TO-236AB. Configuration: surface-mounted component (SMD). Number of terminals: 3. Zener breakdown voltage Uz [V], nom.: 12V. Leakage current on closing Ir [A] @ Ur [V]: 0.1uA @ 8V. Zener Impedance Zzt[Ohm] @ Iz[A]: 25 Ohms @ 5mA. Maximum dissipation Ptot [W]: 0.25W. Housing (according to data sheet): SOT-23 ( 2.9x1.5mm ). Tolerance: 5%. Operating temperature: -55...+150°C. VRRM: 12V. Zener voltage: 12V. Operating temperature range min (°C): -65°C. Operating temperature range max (°C): +150°C

Conditioning: roll. Semiconductor material: silicon. Marking on the case: Y4*. Equivalents: BZX84-C15.215. Dimensions: 2.9x1.5mm. Pd (Power Dissipation, Max): 0.35W. Assembly/installation: surface-mounted component (SMD). Housing: SOT-23 ( TO-236 ). Housing (according to data sheet): SOT-23 ( TO236 ). Tolerance: 5%. Zener voltage: 15V. Number of terminals: 3. Quantity per case: 1. Conditioning unit: 3000

Conditioning: roll. Dielectric structure: Anode-Cathode. Semiconductor material: silicon. Function: SI-Z SMD. Marking on the case: Y6. Pd (Power Dissipation, Max): 0.35W. RoHS: yes. Assembly/installation: surface-mounted component (SMD). Housing: SOT-23 ( TO-236 ). Housing (according to data sheet): SOT-23 ( 2.9x1.5mm ). Tolerance: 5%. Operating temperature: -65...+150°C. Threshold voltage Vf (max): 0.9V. Forward voltage Vf (min): 0.9V. VRRM: 18V. Zener voltage: 18V. Number of terminals: 3. Quantity per case: 1. Conditioning unit: 3000

RoHS: yes. Component family: 350mW (0.35W) zener diode. Surface Mounted Component (SMD). Housing: PCB soldering (SMD). Housing: SOT-23. Configuration: surface-mounted component (SMD). Number of terminals: 3. Zener breakdown voltage Uz [V], nom.: 18V. Leakage current on closing Ir [A] @ Ur [V]: 0.05uA @ 12.6V. Zener Impedance Zzt[Ohm] @ Iz[A]: 45 Ohms @ 5mA. Maximum dissipation Ptot [W]: 0.3W. Operating temperature range min (°C): -55°C. Operating temperature range max (°C): +150°C

RoHS: yes. Component family: zener diode, SMD mounting, max 250mW. Housing: PCB soldering (SMD). Housing: SOT-23. Housing (JEDEC standard): TO-236AB. Configuration: surface-mounted component (SMD). Number of terminals: 3. Zener breakdown voltage Uz [V], nom.: 24V. Leakage current on closing Ir [A] @ Ur [V]: 0.05uA @ 16.8V. Zener Impedance Zzt[Ohm] @ Iz[A]: 70 Ohms @ 5mA. Maximum dissipation Ptot [W]: 0.25W. Operating temperature range min (°C): -65°C. Operating temperature range max (°C): +150°C

Dielectric structure: Anode-Cathode. Semiconductor material: silicon. Function: Zener diode. MRI (max): 2uA. MRI (min): 0.1uA. Temperature: +150°C. Pd (Power Dissipation, Max): 0.5W. RoHS: yes. Assembly/installation: surface-mounted component (SMD). Housing: SOD-123. Housing (according to data sheet): SOD123 ( 2.85x1.7mm ). Tolerance: 5%. Threshold voltage Vf (max): 0.9V. Forward voltage Vf (min): 0.9V. Zener voltage: 27V. Number of terminals: 2. Note: SI-Z SMD. Quantity per case: 1. Operating temperature: +65°C...+150°C

Dielectric structure: Anode-Cathode. Semiconductor material: silicon. Function: SMD ZENER 27V. Pd (Power Dissipation, Max): 0.3W. RoHS: yes. Assembly/installation: surface-mounted component (SMD). Housing: SOT-23 ( TO-236 ). Housing (according to data sheet): SOT-23 ( 2.9x1.5mm ). Tolerance: 5%. Zener voltage: 27V. Number of terminals: 3. Quantity per case: 1

Semiconductor material: silicon. Pd (Power Dissipation, Max): 0.35W. RoHS: yes. Assembly/installation: surface-mounted component (SMD). Housing: SOT-23 ( TO-236 ). Housing (according to data sheet): SOT-23 ( 2.9x1.5mm ). VRRM: 2.7V. Zener voltage: 2.7V. Number of terminals: 3

Semiconductor material: silicon. Dimensions: 2.9x1.5mm. Pd (Power Dissipation, Max): 0.35W. RoHS: yes. Assembly/installation: surface-mounted component (SMD). Housing: SOT-23 ( TO-236 ). Zener voltage: 3.3V. Number of terminals: 3

RoHS: yes. Component family: zener diode, SMD mounting, max 250mW. Housing: PCB soldering (SMD). Housing: SOT-23. Housing (JEDEC standard): TO-236AB. Configuration: surface-mounted component (SMD). Number of terminals: 3. Zener breakdown voltage Uz [V], nom.: 3.3V. Leakage current on closing Ir [A] @ Ur [V]: 5uA @ 1V. Zener Impedance Zzt[Ohm] @ Iz[A]: 95 Ohms @ 5mA. Maximum dissipation Ptot [W]: 0.25W. Operating temperature range min (°C): -65°C. Operating temperature range max (°C): +150°C

Semiconductor material: silicon. Dimensions: 2.9x1.3x1mm. Pd (Power Dissipation, Max): 300mW. RoHS: yes. Pitch: 1.9mm. Assembly/installation: surface-mounted component (SMD). Housing: SOT-23 ( TO-236 ). Housing (according to data sheet): SOT-23. Tolerance: 5%. Zener voltage: 3.6V. Number of terminals: 3

RoHS: yes. Component family: zener diode, SMD mounting, max 250mW. Housing: PCB soldering (SMD). Housing: SOT-23. Housing (JEDEC standard): TO-236AB. Configuration: surface-mounted component (SMD). Number of terminals: 3. Zener breakdown voltage Uz [V], nom.: 3.9V. Leakage current on closing Ir [A] @ Ur [V]: 3.9k Ohms. Zener Impedance Zzt[Ohm] @ Iz[A]: 90 Ohms @ 5mA. Maximum dissipation Ptot [W]: 0.25W. Operating temperature range min (°C): -65°C. Operating temperature range max (°C): +150°C

Semiconductor material: silicon. Dimensions: 2.9x1.5mm. Pd (Power Dissipation, Max): 0.35W. RoHS: yes. Assembly/installation: surface-mounted component (SMD). Housing: SOT-23 ( TO-236 ). Tolerance: 5%. Zener voltage: 4.7V. Number of terminals: 3

RoHS: yes. Component family: zener diode, SMD mounting, max 250mW. Housing: PCB soldering (SMD). Housing: SOT-23. Housing (JEDEC standard): TO-236AB. Configuration: surface-mounted component (SMD). Number of terminals: 3. Zener breakdown voltage Uz [V], nom.: 4.7V. Leakage current on closing Ir [A] @ Ur [V]: 3uA @ 2V. Zener Impedance Zzt[Ohm] @ Iz[A]: 80 Ohms @ 5mA. Maximum dissipation Ptot [W]: 0.25W. Operating temperature range min (°C): -65°C. Operating temperature range max (°C): +150°C

Semiconductor material: silicon. Pd (Power Dissipation, Max): 0.35W. Pitch: 2.9x1.5mm. VRRM: 5V. Number of terminals: 3. Zener breakdown voltage Uz [V], nom.: 5.1V. Leakage current on closing Ir [A] @ Ur [V]: 2uA @ 2V. Zener Impedance Zzt[Ohm] @ Iz[A]: 60 Ohms @ 5mA. Maximum dissipation Ptot [W]: 0.3W. Note: SOT-23. Note: SI-Z SMD. Operating temperature range min (°C): -50°C. Operating temperature range max (°C): +150°C

Dielectric structure: Anode-Cathode. Semiconductor material: silicon. Function: SI-Z SMD. Pd (Power Dissipation, Max): 0.35W. RoHS: yes. Assembly/installation: surface-mounted component (SMD). Housing: SOT-23 ( TO-236 ). Housing (according to data sheet): SOT-23 ( 2.9x1.5mm ). Tolerance: 5%. VRRM: 5.6V. Zener voltage: 5.6V. Number of terminals: 3. Quantity per case: 1

Semiconductor material: silicon. Pd (Power Dissipation, Max): 0.35W. Pitch: 2.9x1.5mm. VRRM: 6V. Number of terminals: 3. Zener breakdown voltage Uz [V], nom.: 6.2V. Leakage current on closing Ir [A] @ Ur [V]: 3uA @ 4V. Zener Impedance Zzt[Ohm] @ Iz[A]: 400 Ohms @ 1mA. Maximum dissipation Ptot [W]: 0.25W. Note: SOT-23. Note: SI-Z SMD. Operating temperature range min (°C): -65°C. Operating temperature range max (°C): +150°C

Dielectric structure: Anode-Cathode. Semiconductor material: silicon. Marking on the case: Y61. Pd (Power Dissipation, Max): 0.35W. RoHS: yes. Assembly/installation: surface-mounted component (SMD). Housing: SOT-23 ( TO-236 ). Housing (according to data sheet): SOT-23 ( 2.9x1.5mm ). VRRM: 6.8V. Zener voltage: 6.8V. Number of terminals: 3. Quantity per case: 1

Semiconductor material: silicon. Pd (Power Dissipation, Max): 0.35W. Pitch: 2.9x1.5mm. VRRM: 7V. Note: SOT-23. Note: SI-Z SMD

Semiconductor material: silicon. Pd (Power Dissipation, Max): 0.35W. Pitch: 2.9x1.5mm. VRRM: 8V. Note: SOT-23. Note: SI-Z SMD