Diameter: 0.7mm. Weight: 500g. Type: Lead free. Eutectic: no. Solder flux capacity: 3%/3/1.1.3. Solder temperature: +340...+420°C. Solidification point (°C): +227°C. Melting point (°C): +227°C. RoHS: yes. Standard: ISO 9453--2014. Chemical composition: Sn 99%, Cu 0.7%, Ag 0.3%. Spec info: lead-free, does not require cleaning